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BUSINESS AND ECONOMY - June 2026

Jun 2026

Jun 02, 2026

South Korea surpasses India in market capitalisation in May 2026

In May 2026, South Korea's equity market overtook India's in total market capitalisation, signalling shifting investor sentiment. South Korean listed companies reached almost $5 trillion in value, driven by robust demand for artificial intelligence and semiconductor groups. Meanwhile, India's market capitalisation fell to about $4.8 trillion, causing the country to slip to seventh place globally. Analysts cited tech earnings, export cycles and capital flows as factors shaping the rankings. The development highlights the growing role of advanced technology industries in global finance and the ongoing competitive dynamics between major Asian economies. It also reflects how semiconductor and AI firms influence national market standings.
  • In May 2026, South Korea's market cap surpassed India's at about $5 trillion.
  • India's market cap was around $4.8 trillion, placing it seventh globally.
  • Growth driven by demand for AI and semiconductors in Korea.
  • Shows shifting dynamics in Asia's technology-driven finance.
  • Illustrates the impact of tech firms on national market standings.

Jun 01, 2026

Odisha signs semiconductor MoU with Intel and 3DGS to develop advanced substrate tech

Odisha signed a major semiconductor memorandum of understanding with Intel and US-based 3D Glass Solutions to develop advanced substrate manufacturing technology in India. The project, valued at about $3.3 billion, aims to establish an advanced packaging glass-core substrate facility in the Bhubaneswar-Khurda region, boosting India's domestic semiconductor ecosystem. Government officials said the collaboration will provide technology know-how and process expertise, supporting chip packaging capabilities, attracting high-tech investment, and accelerating India’s semiconductor ambitions under the India Semiconductor Mission. The investment underscores Odisha's role as a growing electronics manufacturing hub and a model for regional industrial development. The MoU was signed on 29 May 2026 during a government ceremony.
  • MoU with Intel and 3DGS for substrate technology.
  • Value around $3.3 billion; plant in Bhubaneswar-Khurda.
  • Aims to boost packaging capability and attract investment.
  • Aligns with India Semiconductor Mission.

Odisha to host $3.3 billion semiconductor packaging facility by Intel and 3DGS

Odisha’s agreement with Intel and 3D Glass Solutions to set up a $3.3 billion advanced packaging substrate facility marks a milestone in India’s push for domestic semiconductor manufacturing. The project involves state support, technology transfer, and capability-building for high-density interconnect and glass-core packaging. Officials say the facility will bolster domestic chip-packaging capacity, attract global suppliers, and create thousands of skilled jobs. The agreement aligns with the National Semiconductor Mission and complements existing investments in semiconductor ecosystems in India. Analysts expect the project to accelerate India’s path to self-reliant supply chains and strengthen Odisha's electronics footprint.
  • $3.3 billion packaging facility announced in Odisha.
  • Industrial partnership includes Intel and 3DGS.
  • Focus on glass-core substrate and high-density interconnect.
  • Aims to expand domestic packaging capacity and jobs.
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