T-Mobile Hyderabad Centre Opens as Global Tech Hub
T-Mobile USA opened its first Global Technology Centre outside the United States in Hyderabad. The facility will focus on software engineering, cybersecurity, cloud technology, data analytics and artificial intelligence. The move strengthens ties with India’s tech talent pool and signals continued foreign corporate investment in IT services and product development. Hyderabad is already a major tech cluster, with capacity to support large-scale research and development. The centre is expected to collaborate with local universities and startups, enhancing innovation output and contributing to the region’s status as a key technology hub in southern India.
T-Mobile opens first non US Global Technology Centre in Hyderabad.
Centre focuses on software, cybersecurity, cloud, data analytics and AI.
Hyderabad’s tech ecosystem gains an additional global investment.
Potential for university collaboration and startup engagement.
Jun 04, 2026
India leads in U.S. unicorn founders; immigrant entrepreneurs drive US startups
India leads in the United States as a country of origin for immigrant founders of U.S. unicorn startups. A National Foundation for American Policy report shows Indian immigrant founders have founded or co-founded 96 U.S. unicorn companies. Immigrants overall founded or co-founded 455 of 775 privately held U.S. billion-dollar startups, meaning immigrant founders are linked to 59% of such companies. Founders come from 76 countries, underscoring the global talent contributing to America’s innovation economy. The findings highlight India's growing role in the U.S. startup ecosystem and the impact of cross-border entrepreneurship on high-value companies.
India leads as origin for U.S. unicorn founders
NFAP report cites 96 Indian immigrant-founded unicorns
Immigrants total: 455 of 775 U.S. unicorns
49%? Actually 59% of unicorns linked to immigrant founders
Founders from 76 countries; strong cross-border entrepreneurship
Jun 03, 2026
US Remains Top Importer of Indian Seafood
During FY 2025–26, the United States remained the largest importer of Indian seafood in value terms, with exports valued at more than ₹20,000 crore. Frozen shrimp continued to account for a major share of shipments. The Indian seafood sector supports coastal livelihoods and export earnings. Strong international demand for Indian seafood reflects growing global competitiveness in the sector. The U.S. market's continued dominance underscores the importance of quality standards, compliance, and diversified product offerings in sustaining export growth. Government agencies continue to work with industry players to ensure sustainable fishing practices and maintain supply chains for the American market.
US remained top importer of Indian seafood in FY2025-26
Exports valued over ₹20,000 crore; frozen shrimp major share
Seafood sector underpins coastal livelihoods
Global demand indicates competitiveness
Emphasis on quality standards and sustainability
BSE and Meesho Launch Project Shikhar
The Bombay Stock Exchange (BSE) and Meesho have launched Project Shikhar to help micro, small and medium enterprises (MSMEs) and digital businesses prepare for public listing. The initiative was announced through a Memorandum of Understanding signed in June 2026 and is linked to the BSE SME platform, which provides smaller businesses access to capital markets. Project Shikhar aims to educate entrepreneurs about listing requirements, corporate governance standards and fundraising opportunities. The programme is expected to strengthen India's startup and MSME ecosystem by encouraging more enterprises to explore public markets. It also supports the government's aim of improving financial inclusion and promoting business growth through digital platforms.
Project Shikhar launched by BSE and Meesho
Aims to assist MSMEs with public listings
Linked to BSE SME platform; promotes capital access
Education on listing, governance, fundraising
Supports financial inclusion and startup growth
Jun 02, 2026
South Korea surpasses India in market capitalisation in May 2026
In May 2026, South Korea's equity market overtook India's in total market capitalisation, signalling shifting investor sentiment. South Korean listed companies reached almost $5 trillion in value, driven by robust demand for artificial intelligence and semiconductor groups. Meanwhile, India's market capitalisation fell to about $4.8 trillion, causing the country to slip to seventh place globally. Analysts cited tech earnings, export cycles and capital flows as factors shaping the rankings. The development highlights the growing role of advanced technology industries in global finance and the ongoing competitive dynamics between major Asian economies. It also reflects how semiconductor and AI firms influence national market standings.
In May 2026, South Korea's market cap surpassed India's at about $5 trillion.
India's market cap was around $4.8 trillion, placing it seventh globally.
Growth driven by demand for AI and semiconductors in Korea.
Shows shifting dynamics in Asia's technology-driven finance.
Illustrates the impact of tech firms on national market standings.
Jun 01, 2026
Odisha signs semiconductor MoU with Intel and 3DGS to develop advanced substrate tech
Odisha signed a major semiconductor memorandum of understanding with Intel and US-based 3D Glass Solutions to develop advanced substrate manufacturing technology in India. The project, valued at about $3.3 billion, aims to establish an advanced packaging glass-core substrate facility in the Bhubaneswar-Khurda region, boosting India's domestic semiconductor ecosystem. Government officials said the collaboration will provide technology know-how and process expertise, supporting chip packaging capabilities, attracting high-tech investment, and accelerating India’s semiconductor ambitions under the India Semiconductor Mission. The investment underscores Odisha's role as a growing electronics manufacturing hub and a model for regional industrial development. The MoU was signed on 29 May 2026 during a government ceremony.
MoU with Intel and 3DGS for substrate technology.
Value around $3.3 billion; plant in Bhubaneswar-Khurda.
Aims to boost packaging capability and attract investment.
Aligns with India Semiconductor Mission.
Odisha to host $3.3 billion semiconductor packaging facility by Intel and 3DGS
Odisha’s agreement with Intel and 3D Glass Solutions to set up a $3.3 billion advanced packaging substrate facility marks a milestone in India’s push for domestic semiconductor manufacturing. The project involves state support, technology transfer, and capability-building for high-density interconnect and glass-core packaging. Officials say the facility will bolster domestic chip-packaging capacity, attract global suppliers, and create thousands of skilled jobs. The agreement aligns with the National Semiconductor Mission and complements existing investments in semiconductor ecosystems in India. Analysts expect the project to accelerate India’s path to self-reliant supply chains and strengthen Odisha's electronics footprint.
$3.3 billion packaging facility announced in Odisha.
Industrial partnership includes Intel and 3DGS.
Focus on glass-core substrate and high-density interconnect.
Aims to expand domestic packaging capacity and jobs.