During FY 2025–26, the United States remained the largest importer of Indian seafood in value terms, with exports valued at more than ₹20,000 crore. Frozen shrimp continued to account for a major share of shipments. The Indian seafood sector supports coastal livelihoods and export earnings. Strong international demand for Indian seafood reflects growing global competitiveness in the sector. The U.S. market's continued dominance underscores the importance of quality standards, compliance, and diversified product offerings in sustaining export growth. Government agencies continue to work with industry players to ensure sustainable fishing practices and maintain supply chains for the American market.
US remained top importer of Indian seafood in FY2025-26
Exports valued over ₹20,000 crore; frozen shrimp major share
Seafood sector underpins coastal livelihoods
Global demand indicates competitiveness
Emphasis on quality standards and sustainability
BSE and Meesho Launch Project Shikhar
The Bombay Stock Exchange (BSE) and Meesho have launched Project Shikhar to help micro, small and medium enterprises (MSMEs) and digital businesses prepare for public listing. The initiative was announced through a Memorandum of Understanding signed in June 2026 and is linked to the BSE SME platform, which provides smaller businesses access to capital markets. Project Shikhar aims to educate entrepreneurs about listing requirements, corporate governance standards and fundraising opportunities. The programme is expected to strengthen India's startup and MSME ecosystem by encouraging more enterprises to explore public markets. It also supports the government's aim of improving financial inclusion and promoting business growth through digital platforms.
Project Shikhar launched by BSE and Meesho
Aims to assist MSMEs with public listings
Linked to BSE SME platform; promotes capital access
Education on listing, governance, fundraising
Supports financial inclusion and startup growth
Jun 02, 2026
South Korea surpasses India in market capitalisation in May 2026
In May 2026, South Korea's equity market overtook India's in total market capitalisation, signalling shifting investor sentiment. South Korean listed companies reached almost $5 trillion in value, driven by robust demand for artificial intelligence and semiconductor groups. Meanwhile, India's market capitalisation fell to about $4.8 trillion, causing the country to slip to seventh place globally. Analysts cited tech earnings, export cycles and capital flows as factors shaping the rankings. The development highlights the growing role of advanced technology industries in global finance and the ongoing competitive dynamics between major Asian economies. It also reflects how semiconductor and AI firms influence national market standings.
In May 2026, South Korea's market cap surpassed India's at about $5 trillion.
India's market cap was around $4.8 trillion, placing it seventh globally.
Growth driven by demand for AI and semiconductors in Korea.
Shows shifting dynamics in Asia's technology-driven finance.
Illustrates the impact of tech firms on national market standings.
Jun 01, 2026
Odisha signs semiconductor MoU with Intel and 3DGS to develop advanced substrate tech
Odisha signed a major semiconductor memorandum of understanding with Intel and US-based 3D Glass Solutions to develop advanced substrate manufacturing technology in India. The project, valued at about $3.3 billion, aims to establish an advanced packaging glass-core substrate facility in the Bhubaneswar-Khurda region, boosting India's domestic semiconductor ecosystem. Government officials said the collaboration will provide technology know-how and process expertise, supporting chip packaging capabilities, attracting high-tech investment, and accelerating India’s semiconductor ambitions under the India Semiconductor Mission. The investment underscores Odisha's role as a growing electronics manufacturing hub and a model for regional industrial development. The MoU was signed on 29 May 2026 during a government ceremony.
MoU with Intel and 3DGS for substrate technology.
Value around $3.3 billion; plant in Bhubaneswar-Khurda.
Aims to boost packaging capability and attract investment.
Aligns with India Semiconductor Mission.
Odisha to host $3.3 billion semiconductor packaging facility by Intel and 3DGS
Odisha’s agreement with Intel and 3D Glass Solutions to set up a $3.3 billion advanced packaging substrate facility marks a milestone in India’s push for domestic semiconductor manufacturing. The project involves state support, technology transfer, and capability-building for high-density interconnect and glass-core packaging. Officials say the facility will bolster domestic chip-packaging capacity, attract global suppliers, and create thousands of skilled jobs. The agreement aligns with the National Semiconductor Mission and complements existing investments in semiconductor ecosystems in India. Analysts expect the project to accelerate India’s path to self-reliant supply chains and strengthen Odisha's electronics footprint.
$3.3 billion packaging facility announced in Odisha.
Industrial partnership includes Intel and 3DGS.
Focus on glass-core substrate and high-density interconnect.
Aims to expand domestic packaging capacity and jobs.
May 31, 2026
Odisha signs semiconductor MoU with Intel and 3D Glass Solutions to boost substrates
Odisha State government signed a major semiconductor MoU with Intel Corporation and 3D Glass Solutions (3DGS) to establish an advanced substrate manufacturing facility in Bhubaneswar–Khurda region. The pact is reported to be worth about $3.3 billion and aims to develop glass-core packaging substrates and related technologies to support high-density chip integration. Officials say the project will strengthen India’s semiconductor ecosystem, improve chip packaging capabilities, and attract high-tech investment. The MoU aligns with national efforts to build indigenous semiconductor capacity and position Odisha as an electronics-manufacturing hub in eastern India. A phased plan over several years emphasizes local job creation and supply-chain development.
MoU with Intel and 3DGS for substrate facility.
Facility to be located in Bhubaneswar–Khurda region.
Projected value around $3.3 billion.
Focus on glass-core packaging substrates.
Aims to strengthen India's semiconductor ecosystem and jobs.
May 28, 2026
NSE signs MoU to develop steel and commodity derivatives ecosystem
National Stock Exchange of India signed a memorandum of understanding with the Steel Users Federation of India to jointly develop the steel and commodity derivatives ecosystem in India. The partnership aims to create a transparent price‑risk management framework and enable hedging through exchange‑traded derivatives for steel industry participants. The initiative is expected to benefit steel manufacturers, processors, MSMEs, OEMs and infrastructure companies by improving price discovery and risk mitigation. The collaboration highlights ongoing efforts to deepen India’s financial markets and provide new tools for industry participants to manage volatility.
MoU between NSE and Steel Users Federation of India
Aims to develop steel and commodity derivatives ecosystem
Focus on price risk management and hedging via derivatives
Beneficiaries include manufacturers, MSMEs, OEMs, and infrastructure players
Signifies deeper integration of financial markets with industry needs
India ranks as a major data center market in Asia Pacific
India is identified as the second‑largest data center market in Asia Pacific, according to a Cushman & Wakefield report. Growth is driven by accelerating AI adoption, hyperscale cloud expansion and rising enterprise demand. India currently has about 1.6 GW of operational capacity and 3.1 GW in the development pipeline. The study, covering 107 global markets across 24 variables, highlights power infrastructure, regulation and risk as key factors. The findings underscore India’s rising role in regional data center development and investment, as firms expand storage and processing capacity to support a rapidly expanding digital economy.
India ranked second in Asia Pacific data center market
Operational capacity: 1.6 GW; under construction/planned: 3.1 GW