General Awareness

SCIENCE & TECHNOLOGY - May 2018

May 2018

Sep 19, 2026

SEMICON India 2026 highlights silicon-to-systems ecosystem in New Delhi

SEMICON India 2026, titled Silicon to Systems: Building the Ecosystems, is being held in New Delhi from 17 to 19 September 2026 at Yashobhoomi. The fifth edition brings together stakeholders across the global semiconductor value chain, including manufacturers, designers, researchers, and policymakers. The event covers manufacturing, design, supply chains, advanced packaging, artificial intelligence, sustainability, and workforce development. It offers a platform to align India’s domestic ecosystem with international partners, showcase investment opportunities, and highlight Make in India efforts in microelectronics. Organizers include the government-supported ISTI network and partner industry bodies, with sessions on incentives, talent development, and cross-sector collaboration.

Event: SEMICON India 2026
Dates: 17–19 September 2026
Venue: Yashobhoomi, New Delhi
Focus: silicon-to-systems ecosystem, AI, packaging
Participants: global manufacturers, designers, researchers, policymakers
Objectives: domestic–international collaboration and investment opportunities

Sep 18, 2026

TCS launches Custom SoC Design Services

On 17 September 2026, Tata Consultancy Services (TCS) launched Custom System-on-Chip (SoC) Design Services for automotive manufacturers and semiconductor companies. The end-to-end engineering service helps design, verify, implement and validate customized chips for next‑generation software‑defined vehicles. The initiative aligns with rising demand for specialised computing in cars, including advanced driver assistance systems (ADAS), electric mobility, connectivity and centralized computing architectures. TCS says its service will assist original equipment manufacturers (OEMs) to reduce development time and costs while improving performance. The move signals India’s growing role in global semiconductor and automotive technology ecosystems.Industry experts say the offering could attract foreign partners and spur local talent in chip design.

Launched on 17 September 2026 by TCS.
Targets automotive OEMs and semiconductor companies.
End-to-end design, verification, implementation and validation.
Focus on ADAS, electric mobility and centralized computing.
Possible attraction of foreign partners and growth of local talent.

Sep 17, 2026

India’s 51st Doppler Weather Radar Inaugurated in Sambalpur

India inaugurated its 51st Doppler Weather Radar in Sambalpur, Odisha, strengthening national weather surveillance. Located near the Mahanadi river basin, the radar will improve nowcasting, crop protection planning, and water-management decisions around the Hirakud Reservoir region. The instrument is part of a nationwide radar network intended to enhance short-range forecasting and disaster readiness. Officials say the radar will provide timely advisories to farmers and enable authorities to issue early warnings during extreme weather events. Sambalpur’s installation demonstrates ongoing investment in meteorology and climate-resilient infrastructure as India expands capacity to monitor atmospheric conditions.

51st Doppler Weather Radar inaugurated in Sambalpur, Odisha.
Aids nowcasting, crop protection, and water management near Hirakud Reservoir.
Part of national radar network for better disaster readiness.
Will provide timely farmer advisories and early warnings.
Reflects ongoing investment in meteorology and climate resilience.

SEMICON India 2026 Inaugurated by Prime Minister Modi

Prime Minister Narendra Modi inaugurated SEMICON India 2026 in New Delhi, marking the fifth edition of the flagship event. Organized by the India Semiconductor Mission (ISM), the Ministry of Electronics and Information Technology (MeitY), and SEMI, the theme was Silicon to Systems: Building the Ecosystem. The conference focuses on strengthening India’s semiconductor and electronics manufacturing, supply chains, and innovation ecosystem. Leaders highlighted policy support, investments in fabrication facilities, talent development, and international partnerships to accelerate domestic production. The inauguration signals India’s ambition to become a global chip and electronics manufacturing hub and to advance digital transformation across sectors through collaborative R&D and industry ties.

PM Modi inaugurated SEMICON India 2026 in New Delhi.
Fifth edition organized by ISM, MeitY, and SEMI.
Theme: Silicon to Systems—Building the Ecosystem.
Focus on manufacturing, supply chains, and partnerships.
Aims to position India as a global semiconductor hub.

Sethuraman Panchanathan Receives 2026 Arthur M. Bueche Award

Sethuraman Panchanathan, a renowned Indian American scientist, has received the 2026 Arthur M. Bueche Award from the National Academy of Engineering in the United States. The honor recognizes outstanding contributions to engineering, technology, and innovation. Panchanathan serves as the director of the U.S. National Science Foundation, leading federal efforts to advance research, development, and STEM education. He is the first Indian American to receive the Bueche Award, highlighting increasing contributions from Indian-origin scientists on the global stage. The award acknowledges decades of work in computing, information technology, and interdisciplinary collaboration that have accelerated discovery and practical applications. His achievement is celebrated by peers and Indian communities worldwide.

First Indian American to win the 2026 Arthur M. Bueche Award.
Award given by the National Academy of Engineering for engineering, technology, and innovation.
Panchanathan is director of the U.S. National Science Foundation.
Recognition reflects contributions in computing and interdisciplinary collaboration.
Significance for Indian-origin scientists on the global stage.

Sep 16, 2026

BRIC-NIPGR launches SPROUT facility to accelerate climate-resilient crop development

Union Minister Dr. Jitendra Singh inaugurated the SPROUT facility at BRIC-NIPGR in New Delhi, a controlled-environment platform for high-throughput phenotyping and rapid screening of crops under diverse conditions. SPROUT, combined with SpeedSeed technology, enables generation cycles of about 40 days in chickpea, drastically shortening traditional breeding timelines. The initiative, part of the BioE3 framework, aims to connect genomics and genome editing with trait validation, supporting climate-resilient crops. Experts from BRIC-NIPGR, DBT, and other institutions attended the event, which also featured discussions on communication and stakeholder engagement to translate lab advances into field benefits.

SPROUT facility inaugurated at BRIC-NIPGR on 16 September 2026
Purpose: high-throughput phenotyping and climate-resilient crops
SpeedSeed enables ~40-day generation cycles in chickpea
Part of BioE3 policy emphasizing biotechnology and circular bioeconomy
Focus on farmer outreach and industry collaboration

Sep 12, 2026

Qualcomm and Amazon collaborate on AI data centre silicon

Qualcomm announced a multi-generational collaboration with Amazon to develop customised silicon for Amazon Web Services (AWS) data centre infrastructure supporting artificial intelligence workloads. The partnership also includes advancements in optical connectivity and broader use of AWS design tools by Qualcomm for chip-development workloads. The agreement aims to accelerate silicon development cycles, improve efficiency in AI infrastructure and reduce time-to-market for advanced AI capabilities. This collaboration reflects growing ties between chipmakers and cloud providers to deliver scalable, energy-efficient hardware for AI applications and larger data-centre workloads.

Partnership between Qualcomm and Amazon (AWS)
Focus: customised silicon for AI data centres
Includes optical connectivity improvements
Qualcomm to use AWS design tools for chip workloads
Aim: faster development cycles and scalable AI hardware
Significance: strengthens cloud‑chip ecosystem

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